MP300 C3

Name: MP300 C3
Brand: NI - National Instruments

Contact Smart Cards Tester

In manufacturing contexts, parametric test and chip initialization, using ISO 7816, SWP, and USB protocols : MP300 C3

Use Cases

The MP300 C3 will typically be used in the following contexts :

Initialisation, OS loading, pre-personalisation, personalisation of contact smart cards, micro-modules, eSIM and smart objects
Test of micro modules on reel to reel test handlers

Please take into consideration that this product is in an EOL state with the following main milestones :

Last time buy : 30 september 2022
End of technical support and FW updates : 31 august 2023
End of HW support : 31 march 2026 for products purchased after 7 february 2022, and 31 march 2024 for products purchased before 7 february 2022

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What is MP300 C3 ?

The MP300 C3 is the market leader for test and (pre-) personalisation of contact smartcards and smart objects in manufacturing contexts. It is used at the factories of the major smart card and chip manufacturers. This tool perfectly integrated the constraints of the manufacturing world : high throughput, reliability, and efficiency. The main characteristics of the MP300 C3 are :

Support of ISO 7816, SWP/HCI (ETSI TS 102.613 and ETSI TS 102.622), USB 2.0, I2C
Very flexible in the definition of the test parameters (voltages, clock frequency)
Performs open/short, leakage, consumption, drivability, parametric testing
Ideal tool to test and personalize form factors such as ID-1 smartcards, SIM (micro SIM, nano SIM, eSIM), M2M modules, tape of components
Easy to control thanks to its open API
Modular structure : up to 4 MP300 C3 can be installed on one MP300 mother board
Modular structure : the MP300 C3 can be installed together with a MP300 CL3 for test of dual interface components

Download datasheet

Technical Data

Supported protocols

ISO/IEC 7816-3

– T=0 and T=1 protocols : 100% implemented, managed by Firmware and FPGA, accelerated by hardware

SWP/HCI (ETSI TS 102.613 and ETSI TS 102.622)

– SWP transmission : Assisted by hardware
– LLC layers support : ACT, CLT, S-HDLC realised by firmware

USB 2.0

– Available speeds : Low speed, full speed
– Classes : ISO/IEC 7816-12, mass storage, custom protocols

-modes supported :
+standard mode
+fast mode
+fast mode plus

– supports clock stretching, multi master arbitration, anti tearing

– programmable parameters :
+setup time, hold time, start and stop condition
+clock high and low states
+address width (7 and 10 bits)
+nack condition

Synchronous chips

– Support of all kind of memory components (SLE 46xx, T2G, …)

Raw mode

– Implementation of custom protocols and support of out of standard chips

Programmable parameters

Physical parameters

– Voltages
+Vcc : Adjustable from 0V to 10V
+ Vol/Voh : 0V to 5V / 1V to 7V
+ Vil/Vih : 0.2V to 5V / 1V to 6.8V
– Clock frequency
+ ISO 7816 clock :
– Adjustable from 10kHz to 20Mhz
– Duty cycle : can be adjusted from 30% to 70%

Pin states

– All pins can be managed separately

ISO 7816 communication parameters

– Adjustable parameters : All normative timings (WWT, BWT, CWT, …), parity, pull-up resistor

SWP communication parameters

– Available baudrates :106 kbps, 212 kbps, 424 kbps, 848 kbps, 1,6Mbps
– Adjustable parameters : Activation time, P2, P3 parameters, current detection level

Available tests

Electrical tests

– Open/short test (on all contacts,current forced can be adjusted)
– Leakage current (all contacts)
– Voltage measurement (all contacts, static, dynamic, burst mode)
– Current measurement (all contacts, static, dynamic, burst mode)
– Parametric tests (V=f(I), I=f(V))
– SWP specific measurement (statistics on SWP S2 current values)

Logical tests

– ISO 7816 and SWP concurrent I/O testing : send frames in ISO and SWP simultaneously