MP300 C3
MP300 C3
Use Cases
The MP300 C3 will typically be used in the following contexts :
- Initialisation, OS loading, pre-personalisation, personalisation of contact smart cards, micro-modules, eSIM and smart objects
- Test of micro modules on reel to reel test handlers
- Support of ISO 7816, SWP/HCI (ETSI TS 102.613 and ETSI TS 102.622), USB 2.0, I2C
- Very flexible in the definition of the test parameters (voltages, clock frequency)
- Performs open/short, leakage, consumption, drivability, parametric testing
- Ideal tool to test and personalize form factors such as ID-1 smartcards, SIM (micro SIM, nano SIM, eSIM), M2M modules, tape of components
- Easy to control thanks to its open API
- Modular structure : up to 4 MP300 C3 can be installed on one MP300 mother board
- Modular structure : the MP300 C3 can be installed together with a MP300 CL3 for test of dual interface components
Technical data