MP300 C3+CL3

Dual Interface Smart Card Tester
Test tool to perform parametric tests of dual interface micro modules and M2M components (leakage, consumption, Q factor, resonance frequency, ...)
MP300 C3+CL3MP300 C3+CL3
MP300 C3+CL3MP300 C3+CL3

Use Cases


The MP300 C3/CL3 will typically be used in the following contexts :

  • Initialisation, OS loading, pre-personalisation, personalisation of smartcards, micro-modules, and smart object
  • Test of micro modules on reel to reel test handlers

What is MP300 C3+CL3 ?

The MP300 C3/CL3 is the market leader for tasks related to test and (pre-) personalisation of dual interface smart cards and smart objects. Used at the factories of the major smart card and chip manufacturers, this tool perfectly integrated the constraints of the production world : high throughput, reliability, and efficiency The main characteristics of the MP300 C3/CL3 are :
  • Support of ISO 7816, SWP/HCI (ETSI TS 102.613 and ETSI TS 102.622), USB 2.0
  • Coverage of ISO 14443 A/B, ISO 15693, FeliCaTM, MifareTM, B' (Innovatron), and all NFC Forum tags
  • Coverage of high speed communication (VHBR) in both ASK and PSK modes
  • Very flexible in the definition of the test parameters (voltages, clock frequency, field strength, ...)
  • Performs open/short, leakage, consumption, drivability, parametric testing, resonance frequency, Q factor, ...
  • Ideal tool to test and personalize form factors such as ID-1 smartcards, SIM (micro SIM, nano SIM), M2M modules, tape of components
  • Easy to control thanks to its open API
  • Modular structure : up to 2 MP300 C3/CL3 can be installed on one MP300 mother board
  • Numerous antennas available, including a dual PCD mode-PICC mode model
  • Presence of a SAM card reader

Technical Data





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